|
CyberC 2019 征稿 第11届网络分布式计算与常识发现国际会议 The 11th Int. Conference on Cyber-Enabled Distributed Computing and Knowledge Discovery Guilin, China, October 17 - 19, 2019Web: www.Cyberc.orgPublication: IEEE (EI & Explore), Journal of Sensors (Selected Papers) 2019 Theme: Intelligent Cyberspace via the Convergence of AI, Big Data, 5G and Beyond Technical Co-sponsors: IEEE, IEEE Computer Society, IEEE TCSIM (Technical Committee on Simulation), IEEE Communications Society (ComSoc) Technical Committee on Big Data (TCBD) Organizer: Guilin University of Electronic Technology Co-hosted by: Nanjing University of Posts & Telecommunications, Zhengzhou University, Peng Cheng laboratory Sponsored by: Huawei, AT&T, InfoBeyond, Tech Mahindra Scopes: CyberC promotes in-depth exploration of the most recent research and developments in the fields of AI, big data, distributed computing, clouds, cyber security, pervasive computing, mobile computing, Internet of Things, and other cyber-based technologies. Professors, scientists, engineers, and students in these areas are encouraged to participate. CyberC also welcomes industrial participations. Summits: CyberC 2019 co-hosts Emerging Technology Summit (AI, Big Data, 5G) forum that emphasizes innovative and state-of-art R&D, industry products, specifications, showcases, tutorial, technical transitions, and markets. Cyber network and cybersecurity • Cyber network, configuration, cloud, IoT, and wireless communications • DDoS, Ransomware, and cybersecurity attacks and detection • Multistage attacks, data security, AI and intrusion detection • Risk assessment, management, and network monitoring • Authentication and access Control • Learning model for attack behavior, prediction, and game theory • IoT and security • Deploying machine learning and AI to enhance security and privacy • Cybersafety and privacy • Blockchain theory and its applications (smart grid, healthcare, ICS, etc.) • Deploying machine learning and AI to enhance security and privacy • Cybersafety and privacy, standardization, compliance and forensics • Moving target defensing, image and target detection Cyber Data and Analytics • Big data algorithms, models, and systems for big data • AI, Neural Network, Deep Learning • Machine learning, and big data architecture and analytics
• Big data software design, middleware and analytics • High performance computing, and intensive data networks • Massive data streaming, scalable computing, big data task deployments
• Cloud and high performance computing for big data
• Data retrieval, storage, query, communications, and database
• Data preservation, filter, provenance, and assurance
• Data security, protection, integrity and privacy standards and policies
• Graph mining and opinion mining, and distributed data mining
• Data streaming, multimedia, stream, or web mining
• Image/multimedia data management
• Social media and social network analytics
• Security and information assurance for Big Data Cyber and Distributed Computing • Authentication, trust, privacy and other Cyber security issues
• Parallel and distributed algorithms, resource allocation, and load-balance
• Cloud computing, mobile cloud, mobility-aware cloud data/streams
• SOA, web services, and mobile services (software, infrastructure)
• Web services and internet computing
• Web-caching, content delivery systems and data distribution systems
• Distributed applications, modeling language, and software engineering
• Pervasive/ubiquitous computing and intelligence 5G and Mobile Computing • Wireless networks, mesh networks, MIMO and 5G • Industry control network, networking theory and algorithms
• Wireless embedded sensor systems, body sensor, smart cities & security
• Cognitive radio and SDR
• Future generation communications and pervasive computing
• Peer-to-peer network computing and overlaying networks
• Directional antenna and networking
• FDMA/OFDMA modulations, synchronization, and power optimization
• Mobile IP and Internet technology
• Key, attacking models, privacy, confidentiality & security in mobile networks
• Communication, services, middleware, and multimedia on wireless networks
• QoS, reliability, performance, and communication theory
• Wireless network simulations, implementation, and applications Cyber Computing and Clouds • Autonomic, real-time and self-organizing clouds
• Architectural models for public and private cloud computing
• Cloud resource management and allocation
• Utility models and service pricing
• New parallel / concurrent programming models for cloud computing
• Scientific computation and other applications in the cloud
• Mobility modeling, management and measurement for mobile clouds
• Mobile multimedia content delivery, transferring, and migration
• Content delivery networks using storage clouds
• User Experience and Cyber Security
• Performance evaluation, measurement and optimization
• Communications and network security
• Information security, software security, system security, or cryptography
• Tools, test-bed, simulations, and experimental environments
• Collaborative and cooperative environments
• QoS, Autonomic, reliability, and fault-tolerance Workshops: · Big Data & AI 2019: The 6th International Workshop on Big Data and Artificial Intelligence, Chaired by Xiaolan Xie - Guilin University of Electronic Technology · Security 2019: The 7th workshop on Cyber Security and Privacy, Chaired by Yujue Wang - Guilin University of Electronic Technology, and Hongwei Li - University of Electronic Science and Technology of China · Blockchain 2019: The first workshop on Blockchain, Chaired by Bin Cao - Chongqing University of Posts and Telecommunications, and Lei Zhang - University of Glasgow · IOT 2019: The 3rd International Workshop on Internet of Things and Future Communication Technologies, Chaired Ning Cao - Sanming University INFORMATION FOR AUTHORSThe CyberC 2019 Proceedings will be published by IEEE CPS. Full papers for CyberC 2019 must not exceed 10 pages of IEEE 2-column format, while short papers must not exceed 4 pages. Please visit the conference web site at http://www.cyberc.org for precise formatting and submission instructions. IMPORTANT DATES Submission deadline for full (10-page) and/or short (4-page) papers: May 10, 2019 Notification of acceptance: July 20, 2019 Camera-ready deadline: August 20, 2019 SPECIAL ISSUE CyberC 2019 provides a special channel for you to submit your extended version to Journal of Sensors by MDPI. After submission of a CyberC version, you can submit an extended version to Journal all the time before December 30 2019: First submitted, first reviewed. Other journal information can be found at http://cyberc.org/Callforpapers/SpecialIssue HONORABLE CO-CHAIRS David Lu - AT&T Labs, USA Ya Zhou - Guilin University of Electronic Technology, China GENERAL CO-CHAIRS Bin Xie - InfoBeyond Technology LLC, USA Liang Chang - Guilin University of Electronic Technology, China SUMMIT/KEYNOTE CO-CHAIRS Chi-Ming Chen - AT&T Labs, USA Chonggang Wang - InterDigital, USA TPC CO-CHAIRS Yong Ding - Guilin University of Electronic Technology, China Guangxia Xu - Chongqing University of Posts and Telecommunications, China Ning Wang - Zhengzhou University, China WORKSHOP CO-CHAIRS Bin Cao - Chongqing University of Posts and Telecommunications, China Lei Zhang - University of Glasgow, United Kingdom Xiaolan Xie - Guilin University of Electronic Technology, China Hongwei Li - University of Electronic Science and Technology of China Yujue Wang - Guilin University of Electronic Technology, China Ning Cao - Sanming University, China PUBLICITY CO-CHAIRS Xiaolong Xu - Nanjing University of Posts and Telecommunications, China PUBLICATION CHAIR Bin Xie - InfoBeyond Technology LLC, USA LOCAL CO-CHAIRS Jingwei Zhang - Guilin University of Electronic Technology, China Zhenbing Liu - Guilin University of Electronic Technology, China FINANCIAL CO-CHAIRS Sanjuli Agrawal - Indiana University Southeast, USA Yingbing Yu - Austin Peay State University, USA STUDENT VOLUNTEERS Bingyao Wang - Guilin University of Electronic Technology, China Chengkai Kong - Nanjing University of Posts and Telecommunications, China Chi Zhang - Zhengzhou University, China Dandan Mao - Zhengzhou University, China Linfeng Li - Chongqing University of Posts and Telecommunications, China Lingfeng Shen - Zhengzhou University, China Shuai Jiang - Nanjing University of Posts and Telecommunications, China Wenyao Liu - Guilin University of Electronic Technology, China Xufeng Liu - Zhengzhou University, China Ye Zhang - Chongqing University of Posts and Telecommunications, China Ze Li - Zhengzhou University, China Zhengdong Li - Beijing University of Posts and Telecommunications, China STEERING COMMITTEE Anup Kumar (Chair) - University of Louisville, USA Suryadip Chakraborty - Johnson C. Smith University, USA Chi-Ming Chen - AT&T Labs, USA Chih-Lin I - China Mobile, China Yang Yang - ShanghaiTech University, China Jiangzhou Wang - University of Kent, UK Tzyh-Jong (TJ) Wang - AT&T Labs, USA TECHNICAL PROGRAM COMMITTEE Ahmed H. Desoky - University of Louisville, USA Ahmed Badi - Florida Atlantic University, USA Alexandre Kandalintsev - University of Trento, Italy AtillaElci - Aksaray University, Turkey Atta urRehman Khan - University of Malaya, Malaysia Antonio Abramo - University of Udine, Italy Benoit Hudzia - SAP Research, UK Bo Jiang - Intel, USA Chen Qian - University of Kentucky, USA Chukwuemeka David Emele - University of Aberdeen, UK Dejing Dou - University of Oregon, USA Ding-Yaeh Hung - WuFeng University, Taiwan Donglin Wang - New York Institute of Technology, USA Dorsaf Azzabi - Canadian University of Dubai, UAE Haifeng Zheng - Fuzhou University, China Hsung-Pin Chang - National Chung Hsing University, Taiwan Hufeng Zhou - Brigham and Women's Hospital and Harvard Medical School, USA Hui Lu - Beihang University, P.R. China Huijuan Wu - University of Electronic Science and Technology of China, China Cheng Chang - National DongHwa University, Taiwan Jie Li - University of Tsukuba, Japan Jing He - Kennesaw State University, USA Jorg Dummler - Chemnitz University of Technology, Germany Jun He - University of New Brunswick, Canada Kai Bu - Zhejiang University, China Lanxiang Chen - Fujian Normal University, China Lin Wang - Xiamen University, China Manar Ibrahim FawziHosny - King Saud University, Saudi Arabia Man Ho Au - University of Wollongong, Australia Maurizio Dusi - NEC Laboratories Europe, Germany Min Wu - Oracle Corporation, USA Mohammad Shoeb khan - University of Louisville, USA Mahmoud Daneshmand - Stevens Institute of Technology, New Jersey, USA Nicolas Sklavos - Technological Educational Institute of Patras, Greece Nuno Vasco Lopes - University of Minho, Portugal Omid Mahdi Ebadati E. - THamdard University, India Rajdeep Bhowmik - Cisco Systems Inc., USA Ricardo Lopes Pereira - INESC-ID/Instituto Superior Técnico, Portugal Ricardo Rodriguez - Technological University of Ciudad Juarez, Mexico Shanmugasundaram Hariharan - TRP Engineering College, India Shui Yu - Deakin University, Australia Song Cui - Stanford University, USA Song Guo - The Hong Kong Polytechnic University, Hong Kong SubinShen - Nanjing University of Posts and Telecommunications, China Timothy W. Hnat - University of Memphis, USA Vic Grout - Glyndwr University, UK Wei-Da Hao - Texas A&M University-Kingsville, USA Weirong Jiang - Xilinx, USA Wei Yang - Jiangxi Normal University, China Xian-Hua Han - Ritsumeikan University, Japan Xinyu Que - IBM, USA Yaser Jararweh - Jordan University of Science and Technology, Jordan Zhan lin Ji - University of Limerick, Ireland Zhefu Shi - 微软, USA Zhengyu He - 谷歌, USA AUTHOR CONTACTS
| 
发表于 2019-4-2 10:31:52